Nzira dzekuongorora dzeCeramic Substrates

Parizvino, kuongororwa kukuru kwekupedza kweCeramic Substrate kufukidza kuongorora kwekuongorora, zvimiro zvekutengesa, zvimiro zvemagetsi zvekuongorora, kuita kwekushanda (kushanda kwekushanda) kutarisa uye kuvimbika kuongorora.

Chitarisiko

Kuonekwa kwekutaridzika kweCeramir Mukuwedzera, saizi yehurukuro yeiyo substrate, iyo gobvu yesimbi denderedzwa, iyo warpage (camber) yeiyo substrates, uye kurongeka kweiyo substrate nzvimbo inodiwa kuti iongororwe. Kunyanya kushandiswa kweFlip-chip kusungwa, yakakwira-dents kurongedza, iyo nzvimbo yekuwisira inowanzodikanwa kuti ive pasi pe03% yemapakati.

Mumakore achangopfuura, nekukura kwekuenderera kwehunyanzvi hwekombiyuta uye kuongorora kwebasa revanhu vanoramba vachisimuka, vanenge vachishanda zvakanyanya nekunyorwa kwehunyanzvi hwekungwarira uye kusimudzira kweshanduko uye kusimudzirwa kweindasitiri yekugadzira , uye nzira dzekuona nemidziyo yakavakirwa pamabhuku echigunwe zvishoma nezvishoma ichava nzira yakakosha yekuvandudza hunhu uye kugadzirisa gohwo. Naizvozvo, kushandiswa kwemabhuku ekuona midziyo yekuongorora kune zvekuona kweCeramic Substrate inogona kuvandudza kugona kwekuona uye kuderedza mari inodhura nenzira kwayo.

Mechanical Properties Kuongorora

Zvivakwa zveCeramic Substrate chinonyanya kureva simba rekusungwa kwesimbi waya, inoratidza zvakananga kunaka, iyo simba rakasimba uye kuvimbika, etc.) . Simba rekubatanidza reCeramir Simba rekubatanidza rakakwira. Muchidimbu cheCeramic chakagadzirirwa nekudzikira tembiricha

Nzira dzeyedzo dzeCeramic Metallization Simba pane Substrate inosanganisira:

1) TEPA Nzira: Iyo tepi iri padyo nepamusoro peiyo simbi layer, uye iyo rabha roller inokandirwa pairi kuti ibvise mabhuruku mune yekubatanidza. Mushure memasekondi gumi, dhonza tepi kubva kune kusawirirana perpendicular kune iyo simbi layer, uye kuyedza kana iyo simbi leyer yabviswa kubva ku substrate. Nzira nzira inzira inokodzera bvunzo nzira.

2) Welding Wire Nzira: Sarudza iyo Simbi Wire neDhivha ye 0.5mm kana 1.0mm, Weld zvakananga pamusoro pekunyungudika kwemutariri, uye wobva wayera simba rekuturika kweiyo mitezo yemasimbi padhuze nengarava mita.

3) Peel Simba Nzira: Iyo Simbi Simbi pamusoro peCeramic Substrate inogadziriswa Iyo inomhanyisa kumhanya inodiwa kuti ive 50mm / min uye chiyero frequency inguva gumi / s.

Formal Properties Kuongorora

Iyo inopisa zvivakwa zveCeramic substrate inonyanya kusanganisira mafambiro ekurwisa, kupisa kupesana, kuwedzera kupesana kuwanda uye kurwisa kupokana. Ceramic Substrate anonyanya kuita kupisa kusatariswa kwekuputika mune kifaa comiging, saka yayo yekubatanidza inyowani yakakosha technical index. Iko kupisa kupokana kunonyanya kuedzwa kungave kuchinjika kwakarongedzwa uye kwakaremara pakupisa kwakakwirira, kungave kusimuka kwesimbi

Iyo inovharidzira yekubatana kweCeramic haina hukama neyakaitwa neyakaitwa neCeramic substrate Naizvozvo, iyo inopesana inoparadzira tester (iyo inogona kuyera muviri unodzora muviri uye interface inoparadzira kudzikisira kweiyo mitezo yakawanda) inogona kuongorora zvinobudirira kuitwa kweCeramic substrate.

Magetsi Properties Kuongorora

Iko kuita kwemagetsi kweiyo ceramic substrate inoreva kuti simbi yesimbi kumberi uye kumashure kweiyo substrate iri kuitisa (ingave iyo mhando yeiyo yemukati kuburikidza negomba rakanaka). Nekuda kweiyo Diki Diki yeHope yeDPC Ceramic Substrate, pachave nehurongwa hwakadai sekukasira, kupokana uye nekukasira, nekukurumidza, nekukurumidza) uye kubhururuka ) kazhinji kazhinji inogona kushandiswa kuongorora iyo kuburikidza negomba hunhu hweremijuru substrate.

Kurongedza zvivakwa kuongorora

Iko kurapa kwekuita kweCeramic substrate kunyanya kune welderability uye mhepo yakasimba (yakaganhurirwa kune matatu-matatu-dimensional ceramic substrate). Kuti uvandudze kushamwaridzana kwe waya yekutungamira, denderedzwa resimbi zvine chekuita neAU kana AG inowanzogadzirwa pane iyo simbi yeiyo ceramic substrate (kunyanya iyo yekufambisa iyo yekudzivirira oxidation uye uvandudze hunhu hwekubatanidza hwe waya inotungamira. Weldy inowanzo kuyerwa neAluminium waya Welding michina uye kushushikana metres.

Chip ichi chakaiswa pane iyo 3D ceramic substrate cavity, uye iyo cavity yakaiswa chisimbiso neparara yekuvhara (simbi kana girazi) kuti uzive iyo airtight package yemushini. Iyo mhepo yakasimba yezvinhu zvemaDam uye iyo yelating zvinhu zvinosarudza zvakananga kusimba kwechishandiso chekisimusi, uye mhepo yakasimba yeiyo matatu-dimensional ceramic substrate yakagadzirirwa nenzira dzakasiyana siyana dzakasiyana. Iyo nhatu dzechikamu dzechikamu chinonyanya kushandiswa kuidza iyo mhepo kusimba kweiyo mhepo yezvinyorwa uye chimiro, uye nzira huru dziri fluorine gasi bubble uye helium misa misa spectrometer.

Kuvimbika Kwekuongororwa uye Kuongorora

Kuvimbika kunonyanya kuidza shanduko yeCeramic substrate mune yakatarwa nharaunda (tembiricha yakanyanya, yekudziya, inosanganisira kupisa, yekuchengetedza kupisa, kupisa kwakanyanya, Corrosion Rishance, Corrosion Rishance, High Frequency vibration, etc. Iyo yekukatyamadza samples inogona kuongororwa neCanning Electroncopy (SEM) uye X-Ray Diffracometer (xrd). Scanning Inzwi Microscope (Sam) uye X-Ray Detector (X-Ray) yaishandiswa kuongorora madhiri uye urema.