Nhanganyaya kune zvakananga kusunganidzwa mhangura copper capper substrate (DBC).

DBC Ceramic Substrate Kuwedzera Equenti Zvinhu Pakati Pakati peChinyorwa Pakati PeuteGocs pakati pemhangura uye Cu-o-o-o-o-° ~ ~ ye cu tate uye ceramic substrate yemakemikari metallurgy, uye pakupedzisira kuburikidza neThebhlaphy tekinoroji kuti izadzise maitiro ekugadzirira, achigadzira dunhu.

Iyo Ceramic PCB Substrate yakakamurwa kuita matatu matanda, uye zvinhu zvekusimbisa mukati meiyo AL2O3 kana Aln. Iyo inovharidzira yekubatana kweAl2o3 inowanzoitika Iyo coefficient yekuwedzera kweiyo DBC Substrate yakafanana neiyo yeAl2O3 / Aln, iyo iri pedyo zvakanyanya nekudzikisira kweiyo yekudzora mamiriro akagadzirwa pakati pechip uye isina ceramic Substrate.

Merit :

Nekuti iyo yemhangura foil ine yakanaka yemagetsi yekuita uye inobata maitiro, uye alumina inogona kuita zvinobudirira kudzora kuwedzera kwekuwedzera kwekuwedzera kwakafanana neyelbina, dbc ine zvakanakira zvakanaka Kubata kwevanhu, kusimba kwakasimba uye kuvimbika kwakanyanya, uye kwakashandiswa zvakanyanya mu IGBT, LD uye CPV paakarongedzwa. Kunyanya nekuda kweiyo gobvu mhangura foil foil (100 ~ 600μm), ine zvakanakira zviri mumunda we IGBT uye LD packing.

Zvisina kukwana :

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Mugadziriro yekugadzirira yeDBC Substrate, iyo eutectic tembiricha uye yeokisijeni inoda kudzorwa zvakanyanya, uye nguva yemhando uye quididation tembiricha ndiyo miviri yakakosha. Mushure mekupfira foil iri pre-oxidized, iyo yekubatanidza interface inogona kuumba yakakwana cuxoy chikamu kuti yakanyorova neAl2o3 Ceramic uye mhangura mhirizhonga, ine simba rakanyanya kusunga; Kana iyo mhangura foil isiri pre-oxidized, cuxoy wettability murombo, uye nhamba huru yemakomba uye urema dzicharamba dziri mumusangano wekubatanidza, kuderedza kushamwaridzana uye kufambidzana. Kuti ugadziriswe yeDBC Substeres uchishandisa ALN CERMICS, zvakakodzera kuti urege-oxidize substrates, fomu al2o3 mafirimu, uye wozoita nemhapuru zvemafashoni euterctic maitiro.