Nhanganyaya kune Direct yakarongedzwa Copper Ceramic Substrate (DPC)

Iyo yekugadzirira maitiro eDPC ceramic substrate inoratidzwa mune iyo nhamba. Kutanga, laser inoshandiswa kugadzirira kuburikidza nemakomba pane iyo isina ceramic substrate (iyo Aperture inowanzoitika 60 Iyo magnetron inoshambadzira tekinoroji inoshandiswa kuisa simbi pamusoro peiyo ceramic substrate. Mbeu Dayer (ti / cu), uye wozopedzisa dunhu redunhu kugadzirwa kuburikidza nePhotlithography uye Budiriro; Shandisa Electroplating yekuzadza maburi uye udzore dunhu redunhu redunhu, uye nekuvandudza masangano uye oxidation kudzikisira kweiyo substrate, uye pakupedzisira kubvisa iyo firimu, kunyora mhodzi yekupedza kugadzirira kugadzirira.

Iyo yekupedzisira yekupedzisira yeDPC Substrate kugadzirira Esemps Ememickity Tekinoroji (PCB) Tekinoroji yeCirmology (PCEPLATE, GOLTE KUKUNDA, SOPE KUKONZESA, ETCHING kugadzirisa, nezvimwewo), zvakanakira hunyanzvi zviri pachena.

Zvinhu zvakananga zvinosanganisira:

. Substrate yakakodzera kwazvo kuwiriraniswa kweiyo microelectronic mudziyo kurongedza nezvakakwirira zvinodiwa;

(2) Uchishandisa Laser Drill

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. Kuti upedze, iyo DPC substrate ine hunhu hwekunyanyisa graphic chaiyo uye vertical interconnection, uye ndeye chaiyo ceramic pcb substrate.

Nekudaro, DPC substrates zvakare ine zvimwe zvikanganiso:

(1.

(2 .

Parizvino, DPC ceramic senReter inonyanya kushandiswa mune yakakwirira-simba inotungamirwa kurongedza.